Wafer Fabrication Pricing Report

The Wafer Fabrication Pricing Report is designed to gauge the average prices paid per wafer and mask set for fabless semiconductor companies, as well as integrated device manufacturers (IDMs). The data is collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach.

The Wafer Fabrication Pricing Report includes a written analysis of the survey results and interactive online results showing rolling average wafer prices and average mask set prices for four consecutive quarters by:

• Process Geometry
• Process
• Wafer Size
• Company Type
• Region
• Metal Layers
• Poly-Layers
• Epitaxial
• Development Stage
• Volume of Wafers Produced
• Pricing by Leading Revenue-Producing Fabless Companies

Back-End Pricing Report

The Back-End Pricing Report is available as a stand-alone report or as a section to the Wafer Fabrication Pricing Report. The Back-End Pricing Report shows how much fabless companies and IDMs are paying for outsourced back-end services. The data is collected confidentially and tabulated in aggregate by Grant Thornton LLP.

The Back-End Pricing Report includes a written analysis of the survey results and interactive online results showing rolling average assembly, test and wafer bump prices for four consecutive quarters by:

Assembly

• Company Type
• Region
• Package Family
• Leads
• Units Per Week

Test

• Company Type
• Region
• Test Flow
• Test Type
• Signal Pin Count
• Clock Rate
• Units Per Week
• Tester Platform

Wafer Bump

• Wafer Size
• Company Type
• Region
• Bump Purpose
• Bump Process
• Bump Material
• Layers
• Wafers Per Week

The interactive reports are available to subscribers online, allowing users to easily and quickly find the exact pricing information they need.